Kwimimandla yabathengi be-elektroniki kunye nobuchwepheshe bokuboniswa, inkqubo yokubumba ephezulu{0}}ibonisa isiphelo simisela ngokuthe ngqo ukusebenza kwemveliso, amandla okwakheka, kunye nobomi. Iipaneli zangoku eziphezulu{2}}zokugqibela zisebenzisa i-OLED kunye ne-Mini{3}}i-LED itekhnoloji, kwaye inkqubo yazo yokubumba idibanisa impumelelo yetekhnoloji kwizinto zenzululwazi, ukwenziwa ngokuchanekileyo, kunye nolawulo oluzenzekelayo.
During the substrate molding stage, high-end displays commonly use tempered glass or flexible polyimide (PI) film as a substrate. For rigid panels, a chemical tempering process creates a compressive stress layer on the glass surface, increasing its impact strength to over five times that of ordinary glass. Flexible substrates undergo ultra-thin stretching and multi-layer coating to achieve thickness control down to 0.03mm while ensuring light transmittance (>95%). Ukuchaneka kwegumbi le-vacuum kusetyenziselwa ukujika komhlaba kunye neenkqubo ze-encapsulation, apho ukukhanya okuphilayo{2}}izinto ezikhuphayo zifakwe umaleko kunye ne-nanometer{3}}ukuchaneka kwenqanaba. Idityaniswe ne-inorganic / organic composite encapsulation layer, oku kuthintela ngokufanelekileyo ukungena kwamanzi kunye ne-oxygen.
Ukubunjwa kweMini emitsha{0}}imodyuli ze-backlight ze-LED kunomngeni nangakumbi. Itekhnoloji yodluliselo lobuninzi isetyenziselwa ukufakela ngokuchanekileyo amashumi amawaka eemicron{2}}ezinkulu zeetshipsi ze-LED kwi-substrate yesekethe, ngokuchaneka kokubeka kwindawo efunekayo ngaphakathi ±1.5μm. Iziboniso ezigobileyo zisebenzisa inkqubo yokugoba i-thermal, zisebenzisa ukufudumeza kwe-gradient (400-}600 degree) kunye ne-hydroforming ukufikelela kwimigangatho egobileyo ene-R-engile ngaphantsi kwe-1mm ngelixa igcina uzinzo lwesakhiwo semolekyuli yeglasi.
Ezi nkqubo zixhomekeke kulawulo olulungelelanisiweyo lweenkqubo zokuhlola ukukhanya okuzenzekelayo (AOI) kunye ne-AI-imifuziselo yoqikelelo olunamandla, iqinisekisa izinga le-pixel yesiphene esingaphantsi kwesinye kwisigidi kumboniso ngamnye ophezulu{1}}ophezulu. Njengoko iMicro-i-LED kunye nobuchwephesha besikrini esisongekayo buguquka, iinkqubo zokubumba zexa elizayo ziya kuqhubeka zihambela phambili kwi-atomic{4}}yenqanaba lokwenziwa oluchanekileyo kunye nokusetyenziswa kwe-metamatariyali.